I-chipboard engenanto / ekrwada / ibhodi yamasuntswana

Inkcazelo emfutshane:

Ibhodi yesuntswana-ekwaziwa ngokuba yi-chipboard kunye ne-low-density fibreboard (LDF), yimveliso yeenkuni eyenziwe ngobunjineli eyenziwe ngeetshiphu zamaplanga, iishavings zeplanga, okanye i-sawdust, kunye ne-synthetic resin okanye esinye isibophelelo esifanelekileyo, esicinezelwayo kwaye sikhutshwe.
Ngamanye amaxesha zisetyenziswa njengenye indlela yeplywood okanye i-medium density fiberboard ukuthoba iindleko zokwakha.
Iindleko zayo ziphantsi kakhulu phezu komthi oqinileyo okanye iplywood.
Ubunzima obulula bukwenza kube lula ukuthutha kunye nokujikeleza.
Ixesha lokuguqulwa lincinci kakhulu xa lithelekiswa ne-post lamination.


Iinkcukacha zeMveliso

Iithegi zeMveliso

iimveliso Specification

Igama lemveliso Ibhodi ye-particle / i-chipboard / ibhodi ye-flake
Izinto ezingundoqo ifayibha yomthi (ipopoli, ipayini, birch okanye icombi)
Ubungakanani 1220*2440mm, 915*2440mm, 915x2135mm okanye njengoko kufuneka
Ukutyeba 8-25mm (2.7mm, 3mm, 6mm, 9mm, 12mm, 15mm, 18mm okanye xa uceliwe)
Ukunyamezela ukutyeba +/- 0.2mm-0.5mm
Unyango lomphezulu Isanti okanye icinezelwe
Iglu E0/E2 /CARP P2
Ukufuma 8%-14%
Ukuxinana 600-840kg / M3
IModulus Elasticity ≥2500Mpa
Amandla okugoba okuzinzileyo ≥16Mpa
Isicelo Ibhodi ye-Plain particle board isetyenziswa ngokubanzi kwifenitshala, ikhabhinethi kunye nokuhlobisa kwangaphakathi.Ngeepropathi ezilungileyo, amandla okugoba aphezulu, isakhono esomeleleyo sokubamba isikrufu, ukumelana nobushushu, i-anti-static, ixesha elide kwaye akukho siphumo sexesha lonyaka.
Ukupakisha I-1) Ukupakisha kwangaphakathi: I-pallet yangaphakathi ihlanganiswe nge-0.20mm yeplastiki yeplastiki
2) Ukupakishwa kwangaphandle: Iipalati zihlanganiswe ngebhokisi kwaye emva koko iiteyiphu zetsimbi zokuqinisa;

Ipropati

I-chipboard isetyenziselwa kakhulu ukwenza ifenitshala, imisebenzi yangaphakathi, ukwenza izahlulo zodonga, ii-countertops, iikhabhinethi, ukugqunywa kwesandi (kwibhokisi yesithethi) kunye nesiseko seengcango ezigungxulwayo njl ...
1. Ikwazi ukufunxa isandi esilungileyo kunye nokusebenza kokugquma;Ukufakwa kwe-thermal kunye nokufunxa isandi kwibhodi ye-particle;
2. Ingaphakathi liyisakhiwo segranular esine-intersecting and staggered structures, enesikhokelo esifanayo kuzo zonke iindawo kunye nomthamo omhle wokuthwala umthwalo wecala;
3. Ibhodi yesuntswana inomphezulu othe tyaba, ukuthungwa okunokwenyani, ubunzima beyunithi efanayo, impazamo encinci yokuqina, ukuxhathisa ungcoliseko, ukumelana nokuguga, inkangeleko entle, kwaye ingasetyenziselwa iiveneers ezahlukeneyo;Isixa seglue esisetyenzisiweyo sincinci, kwaye i-coefficient yokukhusela indalo iphezulu.


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